002916.SHE Shennan Circuits Co Ltd Class A

The Graham number of Shennan Circuits Co Ltd Class A cannot be estimated reliably (the estimate is too far from the market price).

Graham number = √(22.5 × EPS × book value per share): the most a defensive investor should pay according to Benjamin Graham. An estimate, not a recommendation to buy or sell. How is it calculated?

No fundamental analysis for Shennan Circuits Co Ltd Class A yet.

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Shennan Circuits Co., Ltd. engages in the design, manufacture, and sale of printed circuit boards, packaging substrates, and electronic assemblies in China and internationally. It operates through Packaging Substrates, Packaging Substrates, and Distribution Substrates segments. The company provides RF and microwave, thermal management, miniaturization, and chip package substrate solutions. It also offers schematic design, PCB / SiP design, PCB / SUB production, electronic as…

2026 annualized: Fiscal year 2026 is not finished. Income statement and cash flow are annualized from 3 quarters up to Sep 30, 2026, the balance sheet is the latest quarter. Figures change when the annual report is published.

Shennan Circuits Co Ltd Class A annual financial statements (CNY; K = thousand, M = million, B = billion, T = trillion)

Dividend yield

0.59%

Forward dividend

2.40 CNY

Payout ratio

25.8%

Ex-dividend date

May 29, 2026

From the cash flow statement: dividends paid in the fiscal year, divided by that year's shares outstanding. Payout ratio = dividends paid / net income.

Last stock split: 1.3:1 on May 29, 2025.

Company name

Shennan Circuits Co Ltd Class A

Ticker

002916.SHE

ISIN

CNE100003373

Exchange

Shenzhen Stock Exchange

Sector

Technology

Industry

Electronic Equipment, Instruments & Components

Employees

21,211

Fiscal year end

December

Address

No. 1639 Yanlong Avenue, Shenzhen, China, 518117

Phone

86 755 8930 0000

Website

scc.com.cn

About Shennan Circuits Co Ltd Class A

Shennan Circuits Co., Ltd. engages in the design, manufacture, and sale of printed circuit boards, packaging substrates, and electronic assemblies in China and internationally. It operates through Packaging Substrates, Packaging Substrates, and Distribution Substrates segments. The company provides RF and microwave, thermal management, miniaturization, and chip package substrate solutions. It also offers schematic design, PCB / SiP design, PCB / SUB production, electronic assembly, package testing, and other value creations. The company was formerly known as CATIC Shenzhen Shennan Circuit Company and changed its name to Shennan Circuits Co., Ltd. in January 2000. The company was incorporated in 1984 and is headquartered in Shenzhen, China. Shennan Circuits Co., Ltd. operates as a subsidiary of AVIC International Holdings Limited.

• Mr. Zhiqin YangGM & Director · born 1978
• Mr. Zhiyong LouChief Accountant · born 1976
• Ms. Lijun ZhangDeputy GM, General Counsel & Secretary of the Board of Directors · born 1974
• Mr. Hua MiaoDeputy GM & Chief Engineer · born 1977
• Mr. Li ChenDeputy General Manager · born 1981